Title: In situ TEM Characterization of Phase Transformations and Kirkendall Void Formation During Annealing of a Cu-Au-Sn-Cu Diffusion Bonding Joint

Authors: Cornet, L.; Yedra, L.; Heripre, E.; Aubin, V.; Schmitt, J.H.; Giorgi, M.L.
Journal: Journal of Electronic Materials
Vol: 51
Number: 4
Start page: 1568
Last page: 1582
DOI: doi
Institutional repositories:
Year: 2022
Key: Article